Reactive Ion Etching System (RIE)

Sample size : 4 inch wafer or small samples if 6 inch application, notice advance   Open Load mode
Process Chamber 6061 Aluminum surface anodized
Pump system Mechanical oil pump Domestic  and angle value
Vacuum gauge Edwards APG100
Temperature control for electrode Cycling water provided by customer  
Gas line system 3 lines and 3 MFCs (Domestic metal seal and digit communication)
RF Generator 300w@13.56Mhz
Auto-matched Domestic  
User interface Touch panel
Process application PR0PI and organic material etch and ashing process
Physical size Integration design foot Print reference 100cm * 110cm
Control system Based on industrial PC software self-developed
Special point chamber liner process kits